Features and Benefits
· Good fluidity, excellent solderability can be attained at small pattern of 0.3mm pitch bonding pad.
· Stable printability with little change in viscosity when printing continuously.
· Long Stencil Life - 12 Hours with continuous and consistently printing.
· Remain in the same size, shape and position without slumping after several hours of printing.
· Good solderbility, adequate wettability is shown on various parts.
· Adapted to soldering equipments with different grades; Soldering without nitrogen is available; The soderability is still good in a comparatively wide reflow temperature range, both RSS and RTS temperature setting method are available.
Applications
PCB assembly, including smartphone, Tablet PC, motherboards, consumer electronics, web server, Automobile electrical system, and equipments of medical, military or aerospace etc.
Alloy
|
Size
|
Features&Application
|
---|---|---|
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag | Type3(45~25),Type4(38~20) | CSP Excellent wetting properties, Heat resistance |
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag | Type3(45~25),Type4(38~20) | Tiny pitch for home appliances, vehicle etc. |
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag | Type3(45~25),Type4(38~20) | / |
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag | Type3(45~25);Type4(38~20) | Used in semiconductor packaging |
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag | Type3(45~25);Type4(38~20) | Highly active product |
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag | Type2.5(25~63);Type3(45~25);Type4(38~20) | Low yellow residue,Fit for white board like LED |